鄰甲酚醛環氧樹脂
鄰甲酚醛環氧樹脂，由于其分子結構具有多環氧基結構，固化后生產交聯鍵多而緊密的結構，因而其固化產物具有優良的熱穩定性、機械強度、電絕緣性和耐化學品性。主要用于微電子行業，被廣泛應用于半導體器件、集成電路等分裝材料。
0—? Cresol Formaldehyde Epoxy Resin
Due to the multi-epoxy groups existing in the molecules of 0—cresol formaldehyde epoxy resin, a large amount of tight cross—bondsare formed after being cured,tesulting in excellent thermal stability, mechanical strength, electricity insulateon and chem.icals resistance. It is mainly used in microelectronic Industry. Widely used for the encapsulant of semiconductors and integrated circuits.
產品技術指標：Specifications:
|
序
號
No |
牌號
Brand |
環氧當量
Epoxy
Equivalent
(g/eq) |
可水解***,%
(質量分數)
Hydrolysable
Chlorine Wt%
≤ |
無機***,%
(質量分數)
Inorgano
Chlorine,Wt%
≤ |
軟化點
Softening
Point
(℃) |
熔融粘度
Melting
Viscosity
(150℃) |
揮發份,%
(質量分數)
Volatile,
Wt% |
色度
(加德納法)
Color
(Gardner)
≤ |
主要用途
Application |
|
1 |
CYDCN-100 |
195-210 |
0.015 |
0.0005 |
60~70 |
180~340 |
0.15 |
2 |
塑封料
電子油墨
層壓板等
Encapsulant,electronic printing ink, laminates |
|
2 |
CYDCN-200 |
195-210 |
0.015 |
0.0005 |
60~75 |
340~480 |
0.15 |
2 |
|
3 |
CYDCN-200H |
195-210 |
0.015 |
0.0005 |
60~75 |
480~600 |
0.15 |
2 |
|
4 |
A001-09 |
195-210 |
0.015 |
0.0005 |
60~75 |
420~500 |
0.10 |
2 |
|
5 |
CYDCN-300 |
200-220 |
0.015 |
0.0005 |
75~85 |
— |
0.15 |
2 |
電子油墨
Electronic
Printing ink |
|
6 |
CYDCN-400 |
200-230 |
0.015 |
0.0005 |
85~95 |
— |
0.15 |
2 |
? |
